Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting – Controlling heat transfer with molding material
Reexamination Certificate
2008-01-29
2008-01-29
Heitbrink, Jill L. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
Controlling heat transfer with molding material
C264S328160, C425S144000, C425S547000
Reexamination Certificate
active
07323127
ABSTRACT:
A mold temperature adjusting apparatus is provided in which change-over timing of high temperature medium and low temperature medium is adjusted by a heat transmission delay in heating and cooling of a mold being taken into consideration, so that a cycle time of molding steps is shortened, a temperature deflection from a set temperature of the high temperature and low temperature medium is reduced, an energy loss is reduced and an optimal mold temperature for an injection step can be obtained. The mold temperature adjusting apparatus comprises a high temperature fluid tank and a low temperature fluid tank, a high temperature fluid supply system and a high temperature fluid return system between the mold and the high temperature fluid tank, a low temperature fluid supply system and a low temperature fluid return system between the mold and the low temperature fluid tank, a high temperature fluid by-pass system and a low temperature fluid by-pass system, a heat recovery tank connected to the high temperature fluid tank and a pressure adjusting means.
REFERENCES:
patent: 3259175 (1966-07-01), Kraus et al.
patent: 3847209 (1974-11-01), Mascall
patent: 4680001 (1987-07-01), Waters
patent: 5376317 (1994-12-01), Maus et al.
patent: 5411686 (1995-05-01), Hata
patent: 5427720 (1995-06-01), Kotzab
patent: 5683633 (1997-11-01), Liehr
patent: 5720912 (1998-02-01), Liehr et al.
patent: 6290882 (2001-09-01), Maus et al.
patent: 6312628 (2001-11-01), Wieder et al.
patent: 6598659 (2003-07-01), Frulla
patent: 6991756 (2006-01-01), Saeki et al.
patent: 1 110 692 (2001-06-01), None
patent: 1 493 544 (2005-01-01), None
patent: 10-34657 (1998-02-01), None
patent: 2002-210740 (2002-07-01), None
Partial European Search Report in Application No. EP 05 10 0542 dated May 18, 2005.
European Search Report dated Apr. 12, 2007, issued in corresponding European Application No. 07 10 4015.
Bessho Masahiro
Muranaka Osamu
Toda Naoki
Heitbrink Jill L.
Mitsubishi Heavy Industries Ltd.
Westerman, Hattori, Daniels & Adrian , LLP.
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