Mold releasing resin composition and molding of curable resin us

Details Mold releasing resin composition and molding of curable resin us Mold releasing resin composition and molding of curable resin us

1992-06-12

1994-05-31

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

Shaping against forming surface

106 3822, 106 386, 264300, 528 25, B29C 3358, B29C 3364

Patent

active

053167163

ABSTRACT:
A mold releasing resin composition is provided which contains at least one fluorinated compound end-blocked with a dimethylhydrogensiloxane group and optionally having a fluorinated polyether linkage. The composition is applied to the inner surface of a silicone rubber mold and cured thereat before a curable resin is admitted into the mold, cured therein, and then removed from the mold.

REFERENCES:
patent: 2811408 (1957-10-01), Braley
patent: 3186964 (1965-06-01), Kookootsedes et al.
patent: 3341646 (1967-09-01), Britain
patent: 3406236 (1968-10-01), Kniege
patent: 3492394 (1970-01-01), Heine
patent: 3525783 (1970-08-01), Prikkel, III
patent: 3624190 (1971-11-01), Cekada, Jr.
patent: 3671007 (1972-06-01), Bailey et al.
patent: 3887628 (1975-05-01), Martin
patent: 4184880 (1980-01-01), Huber et al.
patent: 4222951 (1980-09-01), Kreis et al.
patent: 4244912 (1981-01-01), Battice
patent: 4736048 (1988-04-01), Brown et al.
patent: 4840675 (1989-06-01), Fukui et al.
patent: 5152950 (1992-10-01), Ona et al.

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