Mold release layer transferring film and laminate film

Details Mold release layer transferring film and laminate film Mold release layer transferring film and laminate film

2007-08-14

2007-08-14

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S041400, C428S042300, C428S209000, C428S354000, C257S642000, C174S254000, C174S255000, C156S329000, C156S345420

Reexamination Certificate

active

10507242

ABSTRACT:
Provision of a releasing layer transfer film which can form, in a simple manner, a releasing layer on a COF flexible printed wiring board, the releasing layer preventing melt adhesion of an insulating layer to a heating tool, thereby enhancing productivity and reliability of semiconductor devices produced by use of a semiconductor chip mounting line.The releasing layer transfer film1for forming a releasing layer onto an insulating layer serving as a component layer of a COF flexible printed wiring board, the releasing layer transfer film includes a transfer film substrate2and a transferable releasing layer3provided on a surface of the transfer film substrate2, wherein the transferable releasing layer3is formed from a releasing agent and can be transferred onto the insulating layer.

REFERENCES:
patent: 3503782 (1970-03-01), Ayres
patent: 3554835 (1971-01-01), Morgan
patent: 5073422 (1991-12-01), Konno et al.
patent: 5082706 (1992-01-01), Tangney
patent: 5273805 (1993-12-01), Calhoun et al.
patent: 5281455 (1994-01-01), Braun et al.
patent: 5759455 (1998-06-01), Kamitakahara et al.
patent: 5965226 (1999-10-01), Muschelewicz et al.
patent: 6210767 (2001-04-01), Knauf
patent: 6280831 (2001-08-01), Nakanishi et al.
patent: 6280851 (2001-08-01), Pasternack et al.
patent: 6320135 (2001-11-01), Saito
patent: 6441474 (2002-08-01), Naitoh et al.
patent: 6458234 (2002-10-01), Lake et al.
patent: 6476330 (2002-11-01), Otsuka et al.
patent: 6521309 (2003-02-01), Chen et al.
patent: 6548234 (2003-04-01), Gibson
patent: 6572780 (2003-06-01), McCormack et al.
patent: 6605369 (2003-08-01), Takahashi et al.
patent: 6613987 (2003-09-01), Seki et al.
patent: 6617521 (2003-09-01), Saito et al.
patent: 6624520 (2003-09-01), Nakamura
patent: 6761948 (2004-07-01), Schwinn
patent: 6794031 (2004-09-01), Murakami et al.
patent: 6900989 (2005-05-01), Sakata
patent: 6911729 (2005-06-01), Chikawa
patent: 2003/0038379 (2003-02-01), Kawasaki et al.
patent: 2003/0091842 (2003-05-01), Murakami et al.
patent: 2003/0145949 (2003-08-01), Tanaka et al.
patent: 2005/0205972 (2005-09-01), Sakata et al.
patent: 61-50394 (1986-03-01), None
patent: 61-158153 (1986-07-01), None
patent: 3-138392 (1991-06-01), None
patent: 3-157414 (1991-07-01), None
patent: 5-315401 (1993-11-01), None
patent: 9-55402 (1997-02-01), None
patent: 9-115961 (1997-05-01), None
patent: 9-289323 (1997-11-01), None
patent: 10-151408 (1998-06-01), None
patent: 2000-138264 (2000-05-01), None
patent: 2000-353726 (2000-12-01), None
patent: 2001-94232 (2001-04-01), None
patent: 2001-127119 (2001-05-01), None
patent: 2001-210676 (2001-08-01), None
patent: 2001-291739 (2001-10-01), None
patent: 2001-351950 (2001-12-01), None
patent: 2002-9108 (2002-01-01), None
patent: 2002-252257 (2002-09-01), None
patent: 2002-289651 (2002-10-01), None
patent: 2003-338528 (2003-11-01), None
patent: 2004-207669 (2004-07-01), None
patent: 2004-207670 (2004-07-01), None
patent: 2004-207671 (2004-07-01), None

Affiliated with

Also associated with

Rating

Mold release layer transferring film and laminate film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold release layer transferring film and laminate film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold release layer transferring film and laminate film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3891646