Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1997-02-03
1999-05-18
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
257704, 257698, 257696, 257666, 257692, H01L23/04;23/10;29/82;23/08
Patent
active
059053011
ABSTRACT:
A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.
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Hirokawa Tomoaki
Ichikawa Seiji
Kimura Tomoaki
Kubota Tsutomu
Murata Satoshi
NEC Corporation
Thomas Tom
Williams Alexander Oscar
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