Mold, molding assemblies and molding processes

Plastic and nonmetallic article shaping or treating: processes – Direct application of fluid pressure differential to... – Including application of internal fluid pressure to hollow...

Reexamination Certificate

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Details

C264S540000, C425S234000, C425S524000, C425S525000, C425S532000, C425S538000, C053S453000, C053S561000, C053S574000

Reexamination Certificate

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07811506

ABSTRACT:
The invention discloses a mold, a molding assembly and a molding process for molding two tier array of containers of synthetic polymeric material. The process is particularly related to formed, filled and sealed molded containers.

REFERENCES:
patent: 3035302 (1962-05-01), Lysobey
patent: 3267185 (1966-08-01), Freeman, Jr.
patent: 3328837 (1967-07-01), Moran
patent: 3519705 (1970-07-01), Pannenbecker
patent: 3804573 (1974-04-01), Del Piero
patent: 4221760 (1980-09-01), Mnilk et al.
patent: 2004/0071818 (2004-04-01), Dewar
patent: 2457758 (1976-06-01), None
patent: 6246783 (1994-09-01), None
patent: 6278158 (1994-10-01), None
patent: 7032409 (1995-02-01), None
patent: 8290438 (1996-11-01), None
patent: 2001205663 (2001-07-01), None
patent: 2005118255 (2005-12-01), None

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