Mold for printed wiring board

Details Mold for printed wiring board Mold for printed wiring board

1992-03-18

1994-03-22

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With casting, plastic molding, or extruding means

156581, 269287, 269900, 269903, 83942, B32B 3114

Patent

active

052960820

ABSTRACT:
A mold used in producing printed wiring board is disclosed. The mold comprises upper dies and lower dies for sandwiching a printed wiring board therebetween, thereby performing drilling, punching or the like, one of said upper dies and lower dies having a press surface which is provided with concave or convex portions for absorbing steps caused by forming a printed wiring circuit on the printed wiring board.

REFERENCES:
patent: 3232158 (1966-02-01), Breeding
patent: 3307442 (1967-03-01), Imhoff
patent: 3395439 (1968-08-01), Palesi et al.
patent: 3700226 (1972-10-01), Mrugala

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