Mold for molding semiconductor devices

Details Mold for molding semiconductor devices Mold for molding semiconductor devices

1986-05-30

1989-04-04

Hoag, Willard E.

Static molds

Uniting preform with molding material

249110, 249119, 425117, 425127, 4251291, B29C 3910

Patent

active

048182044

ABSTRACT:
A metal mold for plastic molding a semiconductor device by a transfer-molding method with the use of thermo-hardening plastics. The mold includes a pot section into which plastic is injected; a cavity section where a product is formed; a runner section constituting a path for the plastic from the pot section to the cavity section; a gate section provided between the runner section and the cavity section so as to reduce the cross-sectional area for the flow of the plastic which flows therethrough from the runner section to the cavity section; and a flow restrictor section provided in the path of the runner section so as to reduce the cross-sectional area of the flow of plastic.

REFERENCES:
patent: 1918532 (1933-07-01), Geyer
patent: 2239338 (1941-04-01), Norelli
patent: 2672653 (1954-03-01), Simkins et al.
patent: 3270377 (1966-09-01), Parker
patent: 4334847 (1982-06-01), Schauffele
patent: 4513942 (1985-04-01), Creasman
patent: 4611983 (1986-09-01), Bielfeldt

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