Mold for molding a semiconductor package

Details Mold for molding a semiconductor package Mold for molding a semiconductor package

1997-02-10

1998-03-03

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

425117, 425544, 425572, 425573, 26427217, 26432812, B29C 4514, B29C 4526

Patent

active

057231567

ABSTRACT:
A mold for molding a semiconductor package which is capable of guiding a resin material for encapsulating a semiconductor device uniformly into the cavity and prevents the island portion of the support member from being exposed from the molding main body, the mold comprising a pair of mold members for encapsulating a semiconductor device held on the support member, and a gate for guiding a molding resin material into the cavity, the gate being provided in the parting face of parting face of at least one of the mold members, wherein the gate is defined by a U-shape groove including the slanted bottom face inclined at an elevation angle toward the cavity to orient the flow of the resin material, supplied to the gate, toward the half of the cavity defined by the other mold member from the gate, and wherein in the slanted bottom face, there is provided an auxiliary groove for making the resin material, generally guided along the slanted bottom face, partially oriented to a direction different from the direction of the resin flow oriented by the slanted bottom face.

REFERENCES:
patent: 5204122 (1993-04-01), Konishi
patent: 5275546 (1994-01-01), Fierkens
patent: 5371044 (1994-12-01), Yoshida et al.

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