Mold for manufacturing plastic integrated circuits incorporating

Details Mold for manufacturing plastic integrated circuits incorporating Mold for manufacturing plastic integrated circuits incorporating

1991-12-23

1993-10-12

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 95, 26427217, B29C 4514

Patent

active

052520528

ABSTRACT:
A mold for the manufacture of integrated circuit packages of plastics, incorporating a heat sink, includes a first half-shell having a rest bottom for the heat sink, which is associated with a metal frame having a central portion carrying the integrated circuit and being held by filaments, and a second half-shell arranged to overlie the first and having at least one elevated portion which mates with a recessed portion in the first half-shell to compress the filaments on the half-shells being laid over each other.

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