Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1998-07-17
2000-10-31
Davis, Robert
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
425125, 425127, 425588, B29C 4514
Patent
active
061393045
ABSTRACT:
A method and apparatus for encapsulating one or more small electronic devices, including for example light-emitting diodes, mounted directly on a substrate by providing a three-dimensional formation on the substrate adjacent to the device and injection molding a thermoplastic encapsulating material to cover the device and extend over the three-dimensional formation on the substrate and wherein the encapsulating material mechanically bonds to the three-dimensional formation. A gate plate for use in injection molding a thermoplastic encapsulating material over a small electronic device mounted directly on a substrate including a cavity formed to enclose the device, and a short gate formed entirely within the gate plate having an input for receiving an encapsulating material and an output communicating with the cavity. One or more encapsulated electrical devices mounted directly on a substrate, including, for example, an LED or an array of LEDs, wherein the device is fully and individually encapsulated by an encapsulating material which is injection molded onto and mechanically bonded to the substrate.
REFERENCES:
patent: 3271499 (1966-09-01), Schwaiger
patent: 3650648 (1972-03-01), Lambrecht
patent: 3970119 (1976-07-01), Doane
patent: 4170444 (1979-10-01), Fleming et al.
patent: 4246437 (1981-01-01), Frey et al.
patent: 4349693 (1982-09-01), Hinrichs
patent: 4442056 (1984-04-01), Slepcevic
patent: 4463398 (1984-07-01), Boozer et al.
patent: 4463399 (1984-07-01), Matherly et al.
patent: 4810831 (1989-03-01), Hendel
patent: 4840553 (1989-06-01), Arai
patent: 4915607 (1990-04-01), Medders et al.
patent: 4937654 (1990-06-01), Hirabayashi
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5167556 (1992-12-01), Stein
patent: 5226052 (1993-07-01), Tanaka et al.
patent: 5265792 (1993-11-01), Harrah et al.
patent: 5278426 (1994-01-01), Barbier
patent: 5315491 (1994-05-01), Spencer et al.
patent: 5316463 (1994-05-01), Neu
patent: 5326243 (1994-07-01), Fierkens
patent: 5336456 (1994-08-01), Eskildsen et al.
patent: 5429488 (1995-07-01), Neu
patent: 5460502 (1995-10-01), Majercak
patent: 5460503 (1995-10-01), Kitajima et al.
patent: 5475241 (1995-12-01), Harrah et al.
patent: 5585695 (1996-12-01), Kitai
patent: 5661364 (1997-08-01), Kruskopf
patent: 5703394 (1997-12-01), Wei et al.
patent: 5734225 (1998-03-01), Biebuyck et al.
patent: 5747363 (1998-05-01), Wei et al.
patent: 5789280 (1998-08-01), Yokota
patent: 5855924 (1999-01-01), Lumbard
Davis Robert
ITT Manufacturing Enterprises Inc.
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