Mold for injection molding apparatus

Plastic article or earthenware shaping or treating: apparatus – Means applying electrical or wave energy directly to work – Radiated energy

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C425S543000

Reexamination Certificate

active

08057209

ABSTRACT:
A mold for an injection molding apparatus includes a light-transmitting part forming at least a portion of the mold, and configured to transmit light to a cavity to be filled with photo-setting resin.

REFERENCES:
patent: 3196485 (1965-07-01), Battenfeld et al.
patent: 4846651 (1989-07-01), Matsuda et al.
patent: 4992036 (1991-02-01), Herdtner et al.
patent: 5171585 (1992-12-01), Onisawa et al.
patent: 5468315 (1995-11-01), Okada et al.
patent: 6616863 (2003-09-01), Gotoh et al.
patent: 6863515 (2005-03-01), Nakamichi et al.
patent: 7204683 (2007-04-01), Shibata et al.
patent: 2002/0145232 (2002-10-01), Zettel et al.
patent: 2004/0146596 (2004-07-01), Shibata et al.
patent: 2004/0245677 (2004-12-01), Marple et al.
patent: 2005/0238757 (2005-10-01), Niewels et al.
patent: 1064438 (1992-09-01), None
patent: 1464983 (2003-12-01), None
patent: 19705303 (1998-01-01), None
patent: 69923847 (2006-01-01), None
patent: 11-179739 (1999-07-01), None
German Office Action issued in Application No. 102007042755.9-16 dated Nov. 5, 2008.
English translation of German Office Action issued in Application No. 102007042755.9-16 dated Nov. 5, 2008.
English Language translation of JP11-179739.
English Language Abstract for JP11-179739.
Office Action issued in Chinese Application 200710153648.2 on Jun. 19, 2009.
English Language Translation of Office Action issued in Chinese Application 200710153648.2 on Jun. 19, 2009.
English Language Abstract of CN 1064438 published Sep. 16, 1992.
English Language Abstract of DE 19705303 published Jan. 22, 1998.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Mold for injection molding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold for injection molding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for injection molding apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4292747

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.