Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1997-09-19
1999-10-26
Davis, Robert
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
425117, 425127, 425183, 26427217, B29C 4502, B29C 4514
Patent
active
059717343
ABSTRACT:
A mold for BGA semiconductor packages which includes a height adjusting member adapted to adjust the height of the top cavity insert of the top mold or the bottom cavity insert of the bottom mold, an elastic member disposed between the height adjusting member and associated insert, clamping regions of different heights formed at its top or bottom cavity insert, or air vents having a width and depth of an optimum ratio to the area and depth of cavities, thereby being capable of maintaining an optimum and uniform clamping pressure between the top and bottom molds for a variety of PCB strips having a thickness deviation among different portions thereof or having various average thicknesses, upon molding resin encapsulants on those PCB strips, thereby achieving an improvement in the quality of finally produced packages while preventing a sweeping phenomenon of bonding wires electrically connecting a semiconductor chip to conductive traces.
REFERENCES:
patent: 4332537 (1982-06-01), Slepcevic
patent: 4480975 (1984-11-01), Plummer et al.
patent: 4615857 (1986-10-01), Baird
patent: 4861251 (1989-08-01), Moitzger
patent: 5316463 (1994-05-01), Neu
patent: 5405255 (1995-04-01), Neu
patent: 5409362 (1995-04-01), Neu
patent: 5429488 (1995-07-01), Neu
patent: 5645864 (1997-07-01), Higuchi
patent: 5656549 (1997-08-01), Woosley et al.
Amkor Technology Inc.
Anam Semiconductor Inc.
Davis Robert
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