Mold for assembling and forming wire harness

Details Mold for assembling and forming wire harness Mold for assembling and forming wire harness

1997-08-29

2000-07-11

Kuhns, Allan R.

Static molds

Uniting preform with molding material

Including means other than mold surface to support preform

249164, 425116, 425123, 425449, B22D 1900

Patent

active

060860375

ABSTRACT:
A mold for assembling and forming a wire harness preferably includes wire supports extending into a continuous trough which forms a main trunk and a plurality of branches extending from the main trunk. A port introduces a generally liquid sheath material into the trough of the mold. Wires are routed on the wire supports along the main trunk and branches of the trough in the mold. The sheath material is then introduced into the mold and cures around and among the plurality of wires.

REFERENCES:
patent: 2264003 (1941-11-01), Osenberg
patent: 3705228 (1972-12-01), Mattingly
patent: 3768155 (1973-10-01), Bonfiglio et al.
patent: 3856908 (1974-12-01), Harper
patent: 3946768 (1976-03-01), Fiorentino
patent: 3985951 (1976-10-01), Harris
patent: 4239564 (1980-12-01), Krumweide
patent: 4270961 (1981-06-01), Faranetta et al.
patent: 4444705 (1984-04-01), Kumasaka et al.
patent: 4472451 (1984-09-01), Mulder
patent: 4653155 (1987-03-01), Hara
patent: 4799873 (1989-01-01), Martin
patent: 4811439 (1989-03-01), Siegel et al.
patent: 4923537 (1990-05-01), Matsushima
patent: 5030116 (1991-07-01), Sakai et al.
patent: 5082253 (1992-01-01), Suzuki et al.
patent: 5168124 (1992-12-01), Takase et al.
patent: 5182032 (1993-01-01), Dickie et al.
patent: 5230146 (1993-07-01), Tsuji et al.
patent: 5338014 (1994-08-01), Kitamura
patent: 5490664 (1996-02-01), Justus et al.
patent: 5500179 (1996-03-01), Onishi et al.
patent: 5535511 (1996-07-01), Karasik
patent: 5560884 (1996-10-01), Ysbrand
patent: 5598627 (1997-02-01), Saka et al.
patent: 5620711 (1997-04-01), Saito
patent: 5639416 (1997-06-01), Pennisi et al.
patent: 5683796 (1997-11-01), Kornylo et al.

Affiliated with

Also associated with

Rating

Mold for assembling and forming wire harness does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold for assembling and forming wire harness, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for assembling and forming wire harness will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-533698