Mold for a semiconductor package

Details Mold for a semiconductor package Mold for a semiconductor package

1995-04-17

1996-03-26

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 67, 26427217, 4251291, 425186, 425192R, 425544, 425556, 425444, 425DIG228, B29C 4502, B29C 4514

Patent

active

055015883

ABSTRACT:
A mold for a semiconductor package having a port for feeding resin which can be fixed either in an upper mold (1) or a bottom mold (2) corresponding to the location of the flange tip so that the operating rate of the equipment is increased to achieve high productivity.

REFERENCES:
patent: 4723899 (1988-02-01), Osada
patent: 5252051 (1993-10-01), Miyamoto et al.
patent: 5358396 (1994-10-01), Antonius Giesen
patent: 5366368 (1994-11-01), Jang

Affiliated with

Also associated with

Rating

Mold for a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mold for a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold for a semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-912438