Plastic article or earthenware shaping or treating: apparatus – Female mold and charger to supply fluent stock under... – Mold having movable core or movable pin
Reexamination Certificate
2007-12-18
2007-12-18
Heitbrink, Tim (Department: 1722)
Plastic article or earthenware shaping or treating: apparatus
Female mold and charger to supply fluent stock under...
Mold having movable core or movable pin
C425SDIG058
Reexamination Certificate
active
11058205
ABSTRACT:
An injection-molding mold die includes a cylinder and a diameter-enlarging member. The cylinder includes a hollow, an opening, and an external peripheral surface, and has an undercut-forming section formed on the external peripheral surface thereof, which forms a shape incapable of being drafted from the mold die in the direction of opening the same. The diameter-enlarging member enters the hollow through the opening so as to enlarge the external diameter of the cylinder and can relatively advance to or retreat from the hollow. The diameter-enlarging member lies in the hollow when the mold die is clamped and exits the hollow when the mold die is opened. The cylinder is made from a metal having a longitudinal elastic modulus greater than the value of a predetermined pressure, and whose external diameter enlarged by the insertion of the diameter-enlarging member is reduced when the diameter-enlarging member exits the hollow.
REFERENCES:
patent: 4919608 (1990-04-01), Catalanotti et al.
patent: 63-203916 (1988-08-01), None
patent: 5-47534 (1993-06-01), None
patent: 5-76721 (1993-10-01), None
patent: 5-312213 (1993-11-01), None
patent: 7-110028 (1995-04-01), None
patent: 7-190048 (1995-07-01), None
patent: 9-57760 (1997-03-01), None
patent: 10-331841 (1998-12-01), None
patent: 11-311242 (1999-11-01), None
patent: 3056024 (2000-04-01), None
patent: 2000-240640 (2000-09-01), None
patent: 2001-65570 (2001-03-01), None
Matsunaga Haruyuki
Ueda Masanori
Fujitsu Limited
Heitbrink Tim
Kratz Quintos & Hanson, LLP
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