Mold compound cap in a flip chip multi-matrix array package...

Details Mold compound cap in a flip chip multi-matrix array package... Mold compound cap in a flip chip multi-matrix array package...

2007-11-13

2007-11-13

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C029S856000, C257S787000, C257SE21503, C257SE21504

Reexamination Certificate

active

10612764

ABSTRACT:
A molding compound cap structure is disclosed. A process of forming the molding compound cap structure is also disclosed. A microelectronic package is also disclosed that uses the molding compound cap structure. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the molding compound cap structure. The molding compound cap includes a configuration that exposes a portion of a microelectronic device.

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