Mold compound

Details Mold compound Mold compound

1996-06-21

1998-01-20

Marquis, Melvyn I.

Stock material or miscellaneous articles

Composite

Of inorganic material

257707, 257789, 257795, B32B 1900

Patent

active

057099600

ABSTRACT:
An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).

REFERENCES:
patent: 3931026 (1976-01-01), Berkner
patent: 4772644 (1988-09-01), Itoh et al.
patent: 4985751 (1991-01-01), Shiobara et al.
patent: 5451637 (1995-09-01), Leibfried
patent: 5476716 (1995-12-01), Gallo

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