Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting
Reexamination Certificate
2006-11-07
2006-11-07
Heitbrink, Jill L. (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
C264S040500, C264S328100, C425S138000, C425S150000, C425S589000, C425S593000
Reexamination Certificate
active
07132068
ABSTRACT:
In a mold closure position detection method, a mold closure position is detected on the basis of a variation in a physical quantity because of closure of a mold. The method comprises detecting an amount of movement of a movable platen, or a crosshead in the case where the mold clamping apparatus is of a toggle type, during closure of the mold; detecting a variation in the physical quantity because of closure of the mold; obtaining a rate of variation (which encompasses an amount of variation) in the physical quantity to a predetermined amount of movement of the movable platen or the crosshead; and detecting, as a mold closure position, a position of the movable platen or the crosshead when the variation rate reaches a preset ratio.
REFERENCES:
patent: 4281977 (1981-08-01), Farrell
patent: 5059365 (1991-10-01), Hertzer et al.
patent: 6157158 (2000-12-01), Ishikawa
patent: 6419861 (2002-07-01), Stirn et al.
patent: 2004/0067276 (2004-04-01), Watanabe
patent: 62-32020 (1987-02-01), None
patent: 6-61806 (1994-08-01), None
Hakoda Takashi
Kato Toshimi
Birch & Stewart Kolasch & Birch, LLP
Heitbrink Jill L.
Nissei Plastic Industrial Co. Ltd.
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