Metal deforming – By application of fluent medium – or energy field – Using fixed die
Reexamination Certificate
2005-05-17
2005-05-17
Jones, David (Department: 3725)
Metal deforming
By application of fluent medium, or energy field
Using fixed die
C072S062000, C072S455000, C029S421100, C029S512000
Reexamination Certificate
active
06892560
ABSTRACT:
A mold clamping apparatus includes a frame including a holding portion for holding a mold and an open portion allowing the mold to be inserted into/taken out from the holding portion in a direction of the longer side of the mold, a mold moving device for moving the mold to insert/take out the mold into/from the holding portion through the open portion in the frame, and a mold opening/closing device for opening/closing the mold located outside the frame. This mold clamping apparatus is capable of holding the mold securely in a closed state resisting a pressure acting to open the mold and allows reduction of energy consumption, equipment maintenance cost, production cost, and the size thereof.
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Patent Abstracts of Japan, abstract (in English) of JP 05 329693 A.
Haeno Tsutomu
Hiramatsu Koichi
Hiroshige Itsuro
Honda Osamu
Ishibashi Hiroo
Jones David
Nippon Steel Corporation
Toyota Jidosha & Kabushiki Kaisha
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