Metal founding – Means to shape metallic material – Including means to assemble mold parts
Reexamination Certificate
2008-01-08
2008-01-08
Kerns, Kevin P. (Department: 1793)
Metal founding
Means to shape metallic material
Including means to assemble mold parts
C164S312000
Reexamination Certificate
active
07316260
ABSTRACT:
There is provided a mold clamping apparatus which has a space-saving apparatus construction and can easily carry out mold replacement. The mold clamping apparatus includes: a base; a fixed die plate, fixed on the base, for mounting a fixed mold thereto; a movable die plate, disposed opposite the fixed die plate and movably on the base, for mounting a movable mold thereto; a mold opening/closing means for moving the movable die plate closer to and away from the fixed die plate; a plurality of mold clamping cylinders provided in the fixed die plate; mold clamping pistons fit in the mold clamping cylinders; a plurality of tie bars, each detachably mountable at one end to each mold clamping piston and penetrating the movable die plate and extending; a coupling means for releasably coupling each tie bar to the movable die plate at a position as determined depending on the sum of the thickness of the fixed mold and the thickness of the movable mold; and a tie bar retreating means which, when the movable die plate is in a backward position to form a space for mold replacement operation, moves at least one of the plurality of tie bars, which obstructs the mold replacement operation, backward to a retreat position.
REFERENCES:
patent: 4571169 (1986-02-01), Shima et al.
patent: 4781568 (1988-11-01), Inaba
patent: 4984980 (1991-01-01), Ueno
patent: 5542465 (1996-08-01), Wolniak
patent: 2003/0217829 (2003-11-01), Baron et al.
patent: 10-296736 (1998-11-01), None
Itani Shinya
Tsuji Makoto
Usami Kouichi
Yokoyama Hiroshi
Kerns Kevin P.
Pillsbury Winthrop Shaw & Pittman LLP
Toshiba Kikai Kabushiki Kaisha
LandOfFree
Mold clamping apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold clamping apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold clamping apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2809150