Mold assembly with separate encapsulating cavities

Details Mold assembly with separate encapsulating cavities Mold assembly with separate encapsulating cavities

1991-05-28

1992-12-29

Heitbrink, Tim

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Female mold type means

26427214, 2643288, 425130, 425572, 425573, 425588, B29C 4514

Patent

active

051750074

ABSTRACT:
A duo-cavity multigang pot molding assembly (10) for encapsulating semiconductor devices having an annular cavity (11) to form a molded carrier ring and an inner cavity (12) adapted to receive the item to be encapsulated. An outer mold pot (16) provides encapsulating material for the annular cavity (11) whereas a separate mold pot (17) provides encapsulating material for the inner cavity (12). Encapsulating material for the mold pots (16, 17) may be the same or in a preferred embodiment, different. Molding apparatus (10) promotes improved process control by delivering encapsulating material with a lower and more uniform viscosity to both the annular cavity (11) and the inner cavity (12). Further, use of separate mold pots (16, 17) allows cost savings because a less expensive encapsulating material may be used for molding the molded carrier ring since a high purity encapsulating material is not needed.

REFERENCES:
patent: 4368168 (1983-01-01), Slepcevic
patent: 4513942 (1985-04-01), Creasman
patent: 4837184 (1989-06-01), Lin et al.
patent: 4863665 (1989-09-01), Schad et al.

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