Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds
Patent
1989-12-11
1991-09-03
Hoag, Willard E.
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Opposed registering coacting female molds
425127, B29C 4514, B29C 4516, B29C 3910, B29C 3912
Patent
active
050449125
ABSTRACT:
A mold assembly having a first mold half and a second mold half forms a cavity when the first and second mold halves are mated together. Pins or projections, which extend into the cavity, are provided by the mold halves. A semiconductor leadframe rests on the pins provided by the lower mold half and are spaced a short distance from the pins provided by the upper mold half. The pins from the lower mold half support the leadframe whereas the upper mold half pins restrict the movement of the leadframe during an encapsulating procedure. By shortening the pins from the upper mold half the entire upper surface of the leadframe is encapsulated. This eliminates the necessity of having to backfill the holes left in the encapsulating material after the encapsulating procedure.
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Billings David
Hong Soon C.
Barbee Joe E.
Hoag Willard E.
Motorola Inc.
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