Mold assembly for resin-sealing

Details Mold assembly for resin-sealing Mold assembly for resin-sealing

1976-10-29

1977-08-30

Flint, Jr., J. Howard

Static molds

Uniting preform with molding material

Split mold clamps and supports preform

249 83, 425116, 425127, B29C 600

Patent

active

040449840

ABSTRACT:
A mold assembly for resin sealing for use in the manufacture of a semiconductor device etc., includes a pair of upper and lower molds. Elastic deformation parts adapted to be deformed in the direction of compression of the upper and lower molds with an object to-be-sealed, held therebetween, are provided on at least one of a cavity block of the upper mold and a cavity block of the lower mold. Grooves are provided in the surface of the cavity block formed with the elastic deformation parts.

REFERENCES:
patent: 2256769 (1941-09-01), Armine
patent: 3250048 (1966-05-01), Coulon
patent: 3368245 (1968-02-01), Witkowski
patent: 3463845 (1969-08-01), DePass et al.
patent: 3546748 (1970-12-01), Gardner
patent: 3685784 (1972-08-01), Spanjer
patent: 3753634 (1973-08-01), Bliven et al.
patent: 3971841 (1976-07-01), Rubenstein

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