Mold assembly device and method for assembling a...

Details Mold assembly device and method for assembling a... Mold assembly device and method for assembling a...

2011-02-22

2011-02-22

Lin, Kuang (Department: 1735)

Metal founding

Process

Shaping a forming surface

C164S137000, C164S340000

Reexamination Certificate

active

07891402

ABSTRACT:
A mold assembly device and method for assembling a semi-permanent mold assembly is disclosed, the mold assembly device includes a base die and a transfer frame, wherein the transfer frame is capable of transferring a core package to the base die and facilitates assembly of the transfer frame and the core package with the base die.

REFERENCES:
patent: 2768414 (1956-10-01), Dolza
patent: 2783510 (1957-03-01), Dolza et al.
patent: 5423372 (1995-06-01), Kearney
patent: 29609418 (1996-08-01), None
patent: 10302903 (2004-08-01), None
patent: 63-180360 (1988-07-01), None
patent: 64-53756 (1989-03-01), None

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