Plastic article or earthenware shaping or treating: apparatus – Control means responsive to or actuated by means sensing or... – Temperature control
Reexamination Certificate
2011-04-19
2011-04-19
Ewald, Maria Veronica D (Department: 1744)
Plastic article or earthenware shaping or treating: apparatus
Control means responsive to or actuated by means sensing or...
Temperature control
C425S384000, C425S385000, C425S174400, C264S293000
Reexamination Certificate
active
07927089
ABSTRACT:
A deformable mold includes a first surface at which an imprinting pattern is formed. The imprinting pattern (i) is used to imprint a pattern on a substrate and (ii) has a variable size, which varies based on an amount of deformation of the imprinting pattern. A second surface is located opposite from the first surface in a direction of thickness of the mold. A plurality of heat generating members that generate heat have a permeability to ultraviolet light and are disposed at one of (i) the second surface and (ii) between the first surface and the second surface, and the plurality of heat generating members directly contact the mold in order to control the amount of deformation of the imprinting pattern to vary the size of the imprinting pattern. A controller independently controls the plurality of heat generating members and the controller controls at least one of the heat generating members so as to effect anisotropic size correction of the mold in an in-plane direction of the mold.
REFERENCES:
patent: 5705793 (1998-01-01), Kitaichi et al.
patent: 5772905 (1998-06-01), Chou
patent: 5834037 (1998-11-01), Wu
patent: 6334960 (2002-01-01), Willson et al.
patent: 6471501 (2002-10-01), Shinma et al.
patent: 6696220 (2004-02-01), Bailey et al.
patent: 7140861 (2006-11-01), Watts et al.
patent: 2003/0159608 (2003-08-01), Heidari
patent: 2004/0149367 (2004-08-01), Olsson et al.
patent: 2004/0219461 (2004-11-01), Chung et al.
patent: 2006/0001194 (2006-01-01), Cherala et al.
patent: 2006/0198917 (2006-09-01), Ho et al.
patent: 2006/0272535 (2006-12-01), Seki et al.
patent: 2006/0273488 (2006-12-01), Seki et al.
patent: 2006/0279004 (2006-12-01), Suehira et al.
patent: 2006/0279022 (2006-12-01), Seki et al.
patent: A-2003-100625 (2003-04-01), None
patent: 2004-335808 (2004-11-01), None
patent: WO 2004/016406 (2004-02-01), None
patent: WO 2004/044651 (2004-05-01), None
patent: WO 2004/062886 (2004-07-01), None
Chou, Stephen Y., et al. “Imprint of sub-25 nm vias and trenches in polymers,” Appl. Phys. Left.., vol. 67, Issue 21, Nov. 20, 1995. pp. 3114-3116.
Colburn, M., et al., “Step and Flash Imprint Lithography: A New Approach to High-Resolution Patterning,” Emerging Lithographic Technologies III—Proceedings of the SPIE's 24th International Symposium on Microlithography, Yuli Vladimirsky, Editor, Santa Clara, CA, vol. 3676, Part One, Mar. 15-17, 1999. pp. 379-389.
Japanese Office Action dated Mar. 17, 2009, issued in corresponding Japanese Patent Application No. 2006-156014, with a partial English translation.
Majima Masao
Seki Jun-ichi
Suehira Nobuhito
Canon Kabushiki Kaisha
D Ewald Maria Veronica
Fitzpatrick ,Cella, Harper & Scinto
LandOfFree
Mold, apparatus including mold, pattern transfer apparatus,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Mold, apparatus including mold, pattern transfer apparatus,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mold, apparatus including mold, pattern transfer apparatus,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2660201