Moistureproof structure for module circuits

Details Moistureproof structure for module circuits Moistureproof structure for module circuits

1992-09-02

1994-01-04

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

257788, 257790, H01P 130

Patent

active

052764141

ABSTRACT:
The improved moistureproof structure for a module circuit is characterized in that a porous film conditioned to have an apparent relative dielectric constant of no more than 2.0 is coated over a stripline a high-frequency circuit, or a high-frequency device formed on a substrate, which porous film may in turn be provided with a resin coating material. The structure insures that the module circuit is moistureproof, thereby protecting it against corrosion to improve its operational reliability without affecting its electrical characteristics.

REFERENCES:
patent: 3768048 (1973-10-01), Jones, Jr. et al.
patent: 4768081 (1988-08-01), Moeller
patent: 4814943 (1989-03-01), Okuaki
patent: 4888226 (1989-12-01), Wong
patent: 5034801 (1991-07-01), Fischer
patent: 5041395 (1991-08-01), Steffen
patent: 5130780 (1992-07-01), Kumai et al.

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