Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2005-03-01
2005-03-01
Quach, T. N. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C438S118000
Reexamination Certificate
active
06861289
ABSTRACT:
Integrated circuit moisture resistant apparatuses (10) are provided for preventing moisture absorption by an integrated circuit (24). The moisture resistant apparatuses include at least one integrated circuit housing (12) that has a plurality of inner walls (18), which form at least one inner cavity (28). A desiccant body (30) is coupled to at least a portion of the plurality of inner walls (18) and absorbs moisture within the inner cavity (28). A method for performing the same is provided. Also, a manufacturing method of preventing moisture absorption by the integrated circuit (24) is provided.
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Baar James C
Blazier Michael W
Chmielewski Stefan V.
Quach T. N.
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