Moisture relief for chip carrier

Details Moisture relief for chip carrier Moisture relief for chip carrier

1992-08-10

1994-03-22

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

257730, H01L 2328

Patent

active

052967387

ABSTRACT:
An integrated circuit package (10) comprises a semiconductor die (14) having a top surface and a bottom surface, and a substrate (16) for receiving the semiconductor die. The substrate should have an aperture(s) (18) below the semiconductor die for providing moisture relief during temperature excursions. An adhesive (20) applied to the substrate allows for mounting the semiconductor die to the substrate. Then, the semiconductor die is wirebonded to the substrate. Finally, an encapsulant (12) for sealing the top surface of the semiconductor die is formed over the semiconductor die and portions of the substrate.

REFERENCES:
patent: 4329701 (1982-05-01), Brenneman
patent: 4760440 (1988-07-01), Bigler et al.
patent: 4768081 (1988-08-01), Moeller
patent: 4866506 (1989-09-01), Nambu et al.
patent: 4942452 (1990-07-01), Kitano et al.

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