Moisture-curable hot-melt adhesive compositions

Details Moisture-curable hot-melt adhesive compositions Moisture-curable hot-melt adhesive compositions

1995-07-20

1996-04-09

Szekely, Peter A.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525 58, 525 61, 5253288, 525374, C08F21606, C08A 6391, C08L 1922, C08G 1804

Patent

active

055062962

ABSTRACT:
Unique hot-melt adhesive compositions that irreversibly crosslink in a few days in the presence of atmospheric moisture comprise a polyisocyanated EVA terpolymer having a melt index at 190.degree. C. ranging from 100 to 1,000, such polyisocyanated terpolymer comprising (1) from 60% to 90% by weight of ethylene, (2) from 10% to 40% by weight of vinyl acetate and (3) from 5 to 60 meq. OH of an ethylenically unsaturated termonomer bearing at least one primary hydroxyl functional group per mole, and the composition being essentially devoid of free hydroxyl functional groups.

REFERENCES:
patent: 4091195 (1978-05-01), Vitek
patent: 4442145 (1984-04-01), Probst et al.
patent: 4585819 (1986-04-01), Reischle et al.
patent: 4820368 (1989-04-01), Markevka et al.
patent: 4855382 (1989-08-01), Vanhaeren
patent: 4908408 (1990-03-01), Boutillier et al.
patent: 5064902 (1991-11-01), Boutillier et al.
patent: 5189096 (1993-02-01), Boutillier et al.

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