Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...
Reexamination Certificate
2007-05-01
2007-05-01
Yoon, Tae H (Department: 1714)
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
At least one aryl ring which is part of a fused or bridged...
C524S588000, C524S866000, C523S218000, C523S219000
Reexamination Certificate
active
10075203
ABSTRACT:
The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive comprising a polymer or copolymer including reactive silicon end groups; from about 0.01 to about 40 percent by weight of a clear filler that will not substantially interfere with the clarity of the adhesive; and from about 0.01 to about 10 percent by weight of a dehydrating agent. In another embodiment, the present invention includes a moisture curable adhesive comprising a copolymer including a reactive silicon group; from about 33 to about 85 percent by weight of a filler; and from about 0.01 to about 10 percent by weight of a dehydrating agent. The present invention is further directed to a method of joining two adherends.
REFERENCES:
patent: 4308621 (1981-12-01), Mendelson
patent: 4593068 (1986-06-01), Hirose et al.
patent: 4760123 (1988-07-01), Imai et al.
patent: 5298572 (1994-03-01), Katz
patent: 5304621 (1994-04-01), Staiger et al.
patent: 5459205 (1995-10-01), Furukawa et al.
patent: 6013749 (2000-01-01), Baba et al.
patent: 6686047 (2004-02-01), Yamaguchi et al.
patent: 2004/0116547 (2004-06-01), Bennington
patent: 0 106 330 (1984-04-01), None
patent: 0 442 380 (1991-08-01), None
patent: 0 673 972 (1995-09-01), None
patent: 0 442 380 (1996-05-01), None
patent: 0 857 771 (1998-08-01), None
patent: 1 041 119 (2000-10-01), None
patent: 1 279 709 (2003-01-01), None
patent: 2001311056 (2001-11-01), None
patent: WO 00 37534 (2000-06-01), None
Product Brochure, “MS Polymer Silyl”, Kaneka Corporation, 1999.
Kaszubski Glen
Paul John A.
Stypczynski Mark
Tischer Leo August
The Glidden Company
Yoon Tae H
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