Moisture barrier seals for cooled IC chip module assemblies

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361699, 361701, 361705, 361708, 361719, 257714, 257715, 175 151, 175 152, 165 804, 165 805, H05K 720

Patent

active

061250368

ABSTRACT:
A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which features a moisture barrier on its outer wall surface.

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