Moisture and ion barrier for protection of devices and interconn

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

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257759, H01L 2940

Patent

active

061304727

ABSTRACT:
The present invention provides polymeric materials that can be used as a moisture/ion barrier layer for inhibiting the penetration of moisture and/or ions for coming into contact with the metal wiring found in chip level interconnects. The present invention also provides a means to protect the chip backside from being contaminated by metal atoms or metal ions which are capable of forming mobile silicides, which can migrate to the active sites of the semiconductor and destroy them. The present invention further provides methods of forming such polymeric barrier layers on at least one surface of an interconnect structure.

REFERENCES:
patent: 5073814 (1991-12-01), Cole, Jr. et al.
patent: 5945203 (1999-08-01), Soane
D.W. Galipeau, et al., "A Surface Acoustic Wave Sensor Study of Polyimide Thin Film Surface Treatments--Effect on Water Uptake", J. Adhesion Sci. Technol., vol. 8, No. 10, pp. 1143-1156 (1994).

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