Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2005-07-02
2010-06-22
Pham, Thanh V (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S686000, C257S723000, C330S129000, C330S144000
Reexamination Certificate
active
07741710
ABSTRACT:
Systems and methods are disclosed for a device having one or more power amplifier and/or LNA circuits positioned on the amplifier module.
REFERENCES:
patent: 4977041 (1990-12-01), Shiozawa et al.
patent: 5023703 (1991-06-01), Hidaka et al.
patent: 5050238 (1991-09-01), Tomizuka et al.
patent: 5164683 (1992-11-01), Shields
patent: 5255324 (1993-10-01), Brewer et al.
patent: 5283539 (1994-02-01), Sadhir et al.
patent: 5548239 (1996-08-01), Kohama
patent: 5564092 (1996-10-01), Grandfield et al.
patent: 5608364 (1997-03-01), Hirai et al.
patent: 5625894 (1997-04-01), Jou
patent: 5656972 (1997-08-01), Norimatsu
patent: 5697087 (1997-12-01), Miya et al.
patent: 5732334 (1998-03-01), Miyake
patent: 5825227 (1998-10-01), Kohama et al.
patent: 5880635 (1999-03-01), Satoh
patent: 5969560 (1999-10-01), Kohama et al.
patent: 6025651 (2000-02-01), Nam
patent: 6075995 (2000-06-01), Jensen
patent: 6118985 (2000-09-01), Kawakyu et al.
patent: 6148220 (2000-11-01), Sharp et al.
patent: 6151509 (2000-11-01), Chorey
patent: 6175279 (2001-01-01), Ciccarelli et al.
patent: 6183703 (2001-02-01), Hsu et al.
patent: 6198351 (2001-03-01), Winslow
patent: 6203587 (2001-03-01), Lesieur et al.
patent: 6262630 (2001-07-01), Eriksson
patent: 6265943 (2001-07-01), Dening et al.
patent: 6265954 (2001-07-01), Krause
patent: 6281755 (2001-08-01), Feld et al.
patent: 6281762 (2001-08-01), Nakao et al.
patent: 6294967 (2001-09-01), Hirai et al.
patent: 6326866 (2001-12-01), Sasaki et al.
patent: 6366788 (2002-04-01), Fujioka et al.
patent: 6417730 (2002-07-01), Segallis et al.
patent: 6462622 (2002-10-01), Mori et al.
patent: 6483398 (2002-11-01), Nagamori et al.
patent: 6496684 (2002-12-01), Nakao et al.
patent: 6625050 (2003-09-01), Suwa et al.
patent: 6630372 (2003-10-01), Ball
patent: 6639466 (2003-10-01), Johnson
patent: 6677833 (2004-01-01), Sheen
patent: 6678506 (2004-01-01), Dolman et al.
patent: 6683512 (2004-01-01), Nakamata et al.
patent: 6693498 (2004-02-01), Sasabata et al.
patent: 6694129 (2004-02-01), Peterzell et al.
patent: 6696903 (2004-02-01), Kawahara et al.
patent: 6720850 (2004-04-01), Sasabata et al.
patent: 6762659 (2004-07-01), Son et al.
patent: 6774718 (2004-08-01), Ichitsubo et al.
patent: 6798287 (2004-09-01), Wu et al.
patent: 6803818 (2004-10-01), van Amerom
patent: 6822515 (2004-11-01), Ichitsubo et al.
patent: 6847262 (2005-01-01), Ichitsubo et al.
patent: 6911942 (2005-06-01), Fukuda et al.
patent: 6914482 (2005-07-01), Ichitsubo et al.
patent: 7071783 (2006-07-01), Ichitsubo et al.
patent: 2004/0203552 (2004-10-01), Horiuchi et al.
patent: 2004/0204037 (2004-10-01), He et al.
patent: 2005/0179498 (2005-08-01), Tsutsui et al.
patent: 2005/0239415 (2005-10-01), Sagae et al.
patent: 2006/0164188 (2006-07-01), Li et al.
patent: 2001053502 (2001-02-01), None
patent: WO2004049495 (2004-06-01), None
U.S. Appl. No. 10/385,059.
U.S. Appl. No. 10/804,737.
U.S. Appl. No. 10/843,409.
U.S. Appl. No. 10/919,850.
U.S. Appl. No. 10/938,779.
U.S. Appl. No. 10/972,636.
U.S. Appl. No. 11/039,687.
U.S. Appl. No. 11/064,261.
U.S. Appl. No. 11/110,249.
U.S. Appl. No. 11/121,288.
U.S. Appl. No. 11/126,667.
U.S. Appl. No. 11/152,308.
U.S. Appl. No. 11/173,741.
U.S. Appl. No. 11/173,965.
U.S. Appl. No. 11/173,968.
U.S. Appl. No. 11/323,763.
U.S. Appl. No. 11/323,788.
U.S. Appl. No. 11/433,896.
U.S. Appl. No. 11/486,465.
U.S. Appl. No. 60/696,206.
U.S. Appl. No. 60/698,586.
Tie Wang et al., Assessment of Flip Chip Assembly and Reliability via Reflowable Underfill, 2001, IEEE, 2001 Electric Components and technology Conference.
Tie Wang et al., Assessment of Flip Chip Assembly and Reliability via Reflowable Undefill, 2001 IEEE, 2001 Electric Components and technology Conference.
Charles A. Harper, Electronic Packaging and Interconnection handbook, Technical Seminars, Inc. Lutherville, Maryland, Nov. 1, 2006.
Peter Van Zant. Microchip Fabrication, A Practical Guide to Semiconductor Processing, 4thEd., Apr. 3, 2000.
Ichitsubo Ikuroh
Wang Guan-Wu
Wang Weiping
Micro Mobio Corporation
Pham Thanh V
Wen Xin
LandOfFree
Module with multiple power amplifiers and power sensors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Module with multiple power amplifiers and power sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Module with multiple power amplifiers and power sensors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4245221