Module with built-in circuit component and method for...

Details Module with built-in circuit component and method for... Module with built-in circuit component and method for...

2007-07-24

2007-07-24

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S784000, C361S792000, C361S803000

Reexamination Certificate

active

10844823

ABSTRACT:
A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

REFERENCES:
patent: 6038133 (2000-03-01), Nakatani et al.
patent: 6885561 (2005-04-01), Hashemi et al.
patent: 2003/0090883 (2003-05-01), Asahi et al.
patent: 11-220262 (1999-08-01), None

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