Module with adhesively attached heat sink

Details Module with adhesively attached heat sink Module with adhesively attached heat sink

2005-09-27

2005-09-27

Clark, S. V. (Department: 2815)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S118000

Reexamination Certificate

active

06949415

ABSTRACT:
A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.

REFERENCES:
patent: 5724230 (1998-03-01), Poetzinger
patent: 5919329 (1999-07-01), Banks et al.
patent: 5940271 (1999-08-01), Mertol
patent: 5949137 (1999-09-01), Domadia et al.
patent: 5970319 (1999-10-01), Banks et al.
patent: 6015722 (2000-01-01), Banks et al.
patent: 6018196 (2000-01-01), Noddin
patent: 6140707 (2000-10-01), Plepys et al.
patent: 6188578 (2001-02-01), Lin et al.
patent: 6597575 (2003-07-01), Matayabas et al.
patent: 6703704 (2004-03-01), Alcoe et al.
patent: 6749691 (2004-06-01), Misra et al.
patent: 11284097 (1999-10-01), None

Affiliated with

Also associated with

Rating

Module with adhesively attached heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Module with adhesively attached heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Module with adhesively attached heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3370373