Module part and electronic device

Details Module part and electronic device Module part and electronic device

2001-10-16

2003-09-23

Gandhi, Jayprakash N. (Department: 2125)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S728000, C361S736000, C361S784000, C361S790000, C361S807000

Reexamination Certificate

active

06625031

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a module part and an electronic device having the mounting structure, and more particularly, to a module part such as a DC—DC converter to be mounted, e.g., onto a notebook-sized personal computer and electronic devices containing the module parts
2. Description of the Related Art
FIG. 5
is a cross sectional view of a conventional module part and a mounting structure of the module part. In
FIG. 5
, a module part
1
comprises a part-mounting substrate
2
, connecting terminals
3
provided on one main face of the part-mounting substrate
2
, and parts
4
,
5
, and
6
mounted on the other main face of the part-mounting substrate
2
.
The part
4
has a larger height than any other part, and is provided with connecting terminals
4
a
. The connecting terminals
4
a
are soldered to wiring electrodes (not shown) formed on the other main face of the part-mounting substrate
2
. As regards the parts
5
and
6
, connecting electrodes are formed, for example, on the back sides thereof, and are soldered to wiring electrodes similarly to the part
4
. The connecting terminals
3
provided on the one main face of the part-mounting substrate
2
are connected to the wiring electrodes formed on the other main face of the substrate
2
.
The connecting terminals
3
are soldered onto the wiring electrodes (not shown) formed on one main face of the mother board
7
, so that the module part
1
configured as described above is mounted onto the mother board
7
.
FIG. 6
shows a cross sectional view of another conventional module part. In
FIG. 6
, the same or equivalent parts to those shown in
FIG. 5
are designated by the same reference numerals, and the repeated description is omitted.
In
FIG. 6
, a module part
10
contains a part
12
, which also has a large height, instead of the part
4
of the module part
1
shown in FIG.
5
. Connecting terminals
12
a
are provided for the part
12
. Moreover, the module part
10
contains a part-mounting substrate
11
having a first cutoff portion
11
a
with such a size that the part
12
can be placed therein, instead of the part-mounting substrate
2
. The part
12
is placed in the first cut-off portion (hole)
1
a
of the part-mounting substrate
11
to be mounted. The connecting terminals
12
a
are soldered onto wiring electrodes (not shown) formed on the other main face of the part-mounting substrate
11
.
The connecting terminals
3
are provided on the part-mounting substrate
11
similarly to the part-mounting substrate
2
shown in FIG.
5
. The connecting terminals
3
are soldered onto wiring electrodes (not shown) formed on the one main face of the mother board
7
, so that the module part
10
is mounted onto the mother board
7
.
FIG. 7
is a cross sectional view of yet another conventional module part. In
FIG. 7
the same or equivalent parts to those shown in
FIG. 5
are designated by the same reference numerals, and the repeated description is omitted.
A module part
20
of
FIG. 7
is provided with connecting terminals
21
formed on the other main face of the part-mounting substrate
2
, instead of the connecting terminals
3
of the module part
1
shown in FIG.
5
. The connection surface of each connecting terminal
21
in the height direction of each module part
20
is just level with the bottom of the part
4
in the height direction thereof. Here, the connection surface of the connecting terminal
21
means the surface thereof which is connected to the wiring electrode (not shown) formed on the mother substrate
22
.
The part-mounting substrate
2
of the module part
20
configured as described above is placed into a second cutoff portion (hole)
22
a
formed in a mother board
22
, the second cut-off portion
22
a
having such a size that the part-mounting substrate
2
can be placed therein. In this case, the connecting terminals
21
are soldered onto wiring electrodes (not shown) formed on the one main face of the mother substrate
22
.
Referring to the module part
1
shown in
FIG. 5
, the part
4
having a large height is mounted onto the part-mounting substrate
2
. Thus, the module part
1
itself becomes very high. Accordingly, problematically, when the module part
1
is mounted onto the mother board
7
, the whole of a circuit portion containing the module part
1
and the mother board
7
becomes thick, which prevents reduction in the thickness of an electronic device using the mother board
7
.
The part
12
of the module part
10
shown in
FIG. 6
is placed in the cutting-off portion
11
a
of the part-mounting substrate
11
to be mounted. Accordingly, the height of the module part
10
itself is reduced by the thickness of the part-mounting substrate
11
compared to that of the module part
1
shown in FIG.
5
. Thus, the thickness of the whole of a circuit portion containing the module part
10
and the mother board
7
is decreased by the thickness of the part-mounting substrate
11
. However, the decrease in thickness is insufficient. A problem arises in that the thickness of an electronic device using the mother board
7
can be satisfactorily reduced.
Moreover, the height of the module part
20
itself shown in
FIG. 7
is not different from that of the module part
1
shown in FIG.
5
. Since the module part
20
has such a structure as to be placed in the second cut-off portion
22
a
of the mother board
22
to be mounted, the thickness of the whole of a circuit portion containing the module part
20
and the mother board
22
, obtained after the module part
20
is mounted, is decreased by the thickness of the mother board
22
itself. However, problematically, the decrease in thickness is insufficient. Thus, reduction in the thickness of an electronic device using the mother board
22
can not be satisfactorily performed.
SUMMARY OF THE INVENTION
Accordingly, it is an object of the present invention to provide a module part of which the height can be decreased and which serves to reduce the overall thickness of a circuit portion containing the module part and a mother board, obtained after the module part is mounted, and an electronic device using the module part with the above-described problems being solved.
The module part or the present invention comprises: a part-mounting substrate having a first cut-off portion: a part having a large height and mounted to the part-mounting substrate such that at least portion of the part is placed in the first cut-off portion; and a mother board having a second cut-off portion and mounting thereon the part-mounting substrate such that at least a portion of part-mounting substrate is placed in the second cut-off portion.
According to the another aspect of the present invention, the module part comprises: a part-mounting substrate having a first cut-off portion: a part having a large height and mounted to the part-mounting substrate such that at least portion of the part is placed in the first cut-off portion; and a mother board having a second cut-off portion and mounting thereon the part-mounting substrate such that at least a portion of the part is placed in the second cut-off portion.
According to the present invention, the module part contains the part-mounting substrate having the first cutoff portion and the part having a large height placed in the first cut-off portion to be mounted, and the part-mounting substrate has such a structure as to be placed in the second cut-off portion of the mother board, and in the mounting structure of the module part, the part-mounting substrate is placed in the second cut-off portion to be mounted. Thus, the thickness of the whole of a circuit portion containing the module part and the mother board can be reduced.
Alternatively, the module part contains the part-mounting substrate having the first cut-off portion and the part having a large height placed in the first cut-off portion to be mounted, the part having a large height having such a structure as to be placed in the second cutoff portion of the mother board to

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