Module part

Details Module part Module part

2007-01-09

2007-01-09

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

10488552

ABSTRACT:
A module component which includes circuit substrate3having one or more components1on at least one of the surfaces, and junction circuit substrate5having hollow4,or hole, disposed corresponding to the portion of the one or more components1mounted on the one surface of circuit substrate3for fitting the mounted components1in. These substrates are laminated to form a single body so that mounted components1is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

REFERENCES:
patent: 5162540 (1992-11-01), McGarrity et al.
patent: 5703397 (1997-12-01), Endo et al.
patent: 5821762 (1998-10-01), Hamaguchi et al.
patent: 6588097 (2003-07-01), Nishide et al.
patent: 6828670 (2004-12-01), Hayama et al.
patent: 6846375 (2005-01-01), Hayama et al.
patent: 6884938 (2005-04-01), Aoyagi
patent: 2001/0005313 (2001-06-01), Muramatsu et al.
patent: 2002/0017710 (2002-02-01), Kurashima et al.
patent: 2005/0104219 (2005-05-01), Matsui
patent: 11-45955 (1999-02-01), None
patent: 2000-182018 (2000-06-01), None
patent: 2001-210954 (2001-08-01), None
patent: 2001-267490 (2001-09-01), None

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