Module packaging

Details Module packaging Module packaging

1992-05-20

1993-12-07

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 174 523, 257713, 361707, H05K 720

Patent

active

052688143

ABSTRACT:
In a thermal conduction cooling system used in electronic packaging having a hermetic seal and sealing force between a substrate with mounted electronic devices and a cooling cap to prevent the corrosion of the mounted electronic devices during their operation, an improved seal employing an acrylic film which acts both as a hermetic seal and as an adhesive to provide a suitable sealing force between the cold plate and substrate.

REFERENCES:
patent: 3597663 (1971-08-01), Markarian
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patent: 4159221 (1979-06-01), Schuessler
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patent: 4514752 (1985-04-01), Engel et al.
patent: 4685211 (1987-08-01), Hagihara et al.
patent: 4879629 (1989-11-01), Tustaniwskyj et al.
patent: 4914812 (1990-04-01), Webster
patent: 4949219 (1990-08-01), Moriizumi et al.
patent: 4999741 (1991-03-01), Tyler
patent: 5109318 (1992-04-01), Funari et al.

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