Geometrical instruments
Patent
1984-07-10
1985-04-16
McQuade, John
Geometrical instruments
339 17CF, H01R 909
Patent
active
045112010
ABSTRACT:
Apparatus for mounting an integrated circuit module (2) on a printed wiring circuit board (3). The apparatus assembly (1) comprises a ring member (13) for use in assembling a generally rectangular insulating member (11) having a plurality of electrical conducting members (10) positioned therein with a plurality of other insulating members (12) to form quadrilateral configurations of first and second contacts (101, 102) for contacting module terminals (20) and the printed wiring circuit board. A one piece cover (14) engages the ring member to spring clamp the module on the rectangular insulating member and maintain each module terminal in engagement with a corresponding first contact to electrically couple the module with the printed wiring circuit board.
REFERENCES:
patent: 3663920 (1972-05-01), Lapham et al.
patent: 3877064 (1975-04-01), Scheingold et al.
patent: 3940786 (1976-02-01), Scheingold et al.
patent: 4050755 (1977-09-01), Hasircoglu
patent: 4093330 (1978-06-01), Pittman
patent: 4130327 (1978-12-01), Spaulding
patent: 4142287 (1979-03-01), Grabbe
patent: 4144648 (1979-03-01), Grovender
patent: 4155615 (1979-05-01), Zimmerman, Jr. et al.
patent: 4193654 (1980-03-01), Hughes et al.
patent: 4220383 (1980-09-01), Scheingold et al.
patent: 4222622 (1980-09-01), Griffin et al.
patent: 4223370 (1980-09-01), Quere et al.
patent: 4278311 (1981-07-01), Scheingold et al.
patent: 4395084 (1983-07-01), Conrad
patent: 4410223 (1983-10-01), Baker
Baker Paul A.
Strautz Michael G.
AT&T Bell Laboratories
Marshall D. A.
McQuade John
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