Module mounting assembly

Geometrical instruments

Patent

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Details

339 17CF, H01R 909

Patent

active

045112010

ABSTRACT:
Apparatus for mounting an integrated circuit module (2) on a printed wiring circuit board (3). The apparatus assembly (1) comprises a ring member (13) for use in assembling a generally rectangular insulating member (11) having a plurality of electrical conducting members (10) positioned therein with a plurality of other insulating members (12) to form quadrilateral configurations of first and second contacts (101, 102) for contacting module terminals (20) and the printed wiring circuit board. A one piece cover (14) engages the ring member to spring clamp the module on the rectangular insulating member and maintain each module terminal in engagement with a corresponding first contact to electrically couple the module with the printed wiring circuit board.

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patent: 4410223 (1983-10-01), Baker

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