Module mounting and adhesion systems and methods for electronic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

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Details

257730, H01L 2302, H01L 2304

Patent

active

058348344

ABSTRACT:
The present invention relates to mounting and adhesion systems and methods for compact electronic modules. More particularly, the present invention relates to an apparatus and technique for mounting an electronic module that is capable of communicating with an interface unit on a one-way-bus.

REFERENCES:
patent: 3846971 (1974-11-01), Ho et al.
patent: 3996735 (1976-12-01), Zurcher
patent: 4028682 (1977-06-01), Weber et al.
patent: 4040026 (1977-08-01), Gernelle
patent: 4053688 (1977-10-01), Perkins et al.
patent: 4064689 (1977-12-01), Yasuda et al.
patent: 4086752 (1978-05-01), Kishimoto
patent: 4196577 (1980-04-01), Ohno et al.
patent: 4211919 (1980-07-01), Ugon
patent: 4217637 (1980-08-01), Faulkner et al.
patent: 4241418 (1980-12-01), Stanley
patent: 4272838 (1981-06-01), Kasama et al.
patent: 4295220 (1981-10-01), Blum et al.
patent: 4337525 (1982-06-01), Akatsuka
patent: 4396985 (1983-08-01), Ohara
patent: 4400711 (1983-08-01), Avery
patent: 4426159 (1984-01-01), Kosaka et al.
patent: 4475178 (1984-10-01), Kinoshika
patent: 4480178 (1984-10-01), Miller, II et al.
patent: 4486770 (1984-12-01), Woodward
patent: 4509120 (1985-04-01), Daudelin
patent: 4511796 (1985-04-01), Aigo
patent: 4556958 (1985-12-01), Ugon
patent: 4558435 (1985-12-01), Hsieh
patent: 4595941 (1986-06-01), Avery
patent: 4616343 (1986-10-01), Ogawa
patent: 4621190 (1986-11-01), Saito et al.
patent: 4631567 (1986-12-01), Kokado
patent: 4713555 (1987-12-01), Lee
patent: 4717817 (1988-01-01), Grass
patent: 4767918 (1988-08-01), Kushima et al.
patent: 4780707 (1988-10-01), Selker
patent: 4862310 (1989-08-01), Harrington, III
patent: 4868409 (1989-09-01), Tanaba et al.
patent: 4928000 (1990-05-01), Eglise et al.
patent: 4980746 (1990-12-01), Harrington, III
patent: 5032708 (1991-07-01), Comerford et al.
patent: 5049728 (1991-09-01), Rovin

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