Module, method of manufacturing module, and electronic...

Details Module, method of manufacturing module, and electronic... Module, method of manufacturing module, and electronic...

2008-07-01

2008-07-01

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S535000, C174S548000, C174S551000, C174S560000

Reexamination Certificate

active

07394029

ABSTRACT:
A module includes a circuit board, a first terminal on a lower surface of the circuit board, a first electronic component on an upper surface of the circuit board, a first cover made of metal covering the first electronic component, a second electronic component on the lower surface of the circuit board, a terminal board provided under the lower surface of the circuit board, a second terminal on an upper surface of the terminal board, a third terminal provided on the lower surface of the terminal board, and a second cover made of metal covering the second electronic component. The second terminal faces the first terminal and is connected to the first terminal. The third terminal is connected to the second terminal. The terminal board has an opening therein surrounding the second electronic component. The second cover includes a top plate portion located under the second electronic component, and a side plate portion extending from the top plate portion toward the lower surface of the circuit board. The side plate portion is positioned between the second electronic component and an inner periphery of the opening. This module occupies a small area.

REFERENCES:
patent: 4658334 (1987-04-01), McSparran et al.
patent: 4661888 (1987-04-01), Jewell et al.
patent: 5252782 (1993-10-01), Cantrell et al.
patent: 5550713 (1996-08-01), Pressler et al.
patent: 6037846 (2000-03-01), Oberhammer
patent: 6194655 (2001-02-01), Lange et al.
patent: 2004/0256128 (2004-12-01), King et al.
patent: 2005/0236171 (2005-10-01), Garcia
patent: 10-290174 (1998-10-01), None

Affiliated with

Also associated with

Rating

Module, method of manufacturing module, and electronic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Module, method of manufacturing module, and electronic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Module, method of manufacturing module, and electronic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2749661