Module integration integrated circuits

Details Module integration integrated circuits Module integration integrated circuits

2004-06-02

2008-08-05

Urban, Edward (Department: 2618)

Telecommunications

Receiver or analog modulated signal frequency converter

Frequency modifying or conversion

C455S339000, C455S341000, C333S246000, C257S723000

Reexamination Certificate

active

07409200

ABSTRACT:
A first signal conditioning circuit is formed from a first portion, a second portion and a third portion. Signal conditioning functions of each of these portions are facilitated by a predetermined type of integrated semiconductor die within which they are formed. Two different semiconductor dies are thus provided for facilitating integration of the first through third signal conditioning portions therein. Wire bonds are provided between the two different semiconductor dies in order to form circuit paths between the different first through third portions. The signal routing using between the two different semiconductor dies provides for completing of the first signal conditioning circuit having a first signal conditioning function. For example, circuits such as interstage matching circuits are disposed on a different semiconductor die than power amplifier circuits.

REFERENCES:
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5731945 (1998-03-01), Bertin et al.
patent: 5844853 (1998-12-01), Kitsukawa et al.
patent: 5983089 (1999-11-01), Mohwinkel et al.
patent: 6054900 (2000-04-01), Ishida et al.
patent: 6075995 (2000-06-01), Jensen
patent: 6734553 (2004-05-01), Kimura
patent: 7164905 (2007-01-01), Tamaki et al.
patent: 7245884 (2007-07-01), Oida et al.
patent: 2001/0011926 (2001-08-01), Adar
patent: 2003/0165052 (2003-09-01), Negishi et al.
patent: 0 436 074 (1991-07-01), None
patent: 0 543 430 (2003-05-01), None
patent: 1 385 305 (2004-01-01), None
patent: 2001298123 (2001-10-01), None
patent: WO 96/13965 (1996-05-01), None
patent: WO 03/061174 (2003-07-01), None
Guckenberger et al., “Integrated DC-DC Converter Design for Improved WCDMA Power Amplifier Efficiency in SiGe BiCMOS Technology”, Proceedings of the 2003 International Symposium on Low Power Electronics and Design ISLPED '03, Aug. 25-27, 2003, pp. 449-454.
Diels et al., “Single Package Integration of RF Blocks for a.5 Ghz WLAN Application”, IEEE Transactions on Advanced Packaging, vol. 24, No. 3, Aug. 2001, pp. 384-391.
Furst R: “With GaAs Mmics Towards Dual Band Front End Applications In Wireless Communication” European Microwave Conference. Conference Proceedings, vol. 2, Sep. 8, 1997, pp. 1289-1294, XP010253196.
USPTO, for U.S. Appl. No. 10/680,208, 1stRestriction Requirement mailed Sep. 13, 2006.
U.S. Appl. No. 10/680,208, response to 1stRestriction Requirement filed Oct. 12, 2006.
USPTO, for U.S. Appl. No. 10/680,208, 2ndRestriction Requirement mailed Apr. 5, 2007.
U.S. Appl. No. 10/680,208, response to 2ndRestriction Requirement filed May 3, 2007.
USPTO, for U.S. Appl. No. 10/680,208, 1stOffice Action mailed Dec. 26, 2007.

Affiliated with

Also associated with

Rating

Module integration integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Module integration integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Module integration integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4006301