Module integrating MEMS and passive components

Details Module integrating MEMS and passive components Module integrating MEMS and passive components

2007-02-27

2007-02-27

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C438S106000, C977S701000, C977S724000

Reexamination Certificate

active

10882635

ABSTRACT:
An apparatus may include a first substrate, one or more microelectromechanical systems (MEMS) coupled to the first substrate, a second substrate coupled with the first substrate, and one or more passive components coupled to the second substrate. A method may include aligning a first substrate having one or more MEMS coupled thereto and a second substrate having one or more passive components coupled thereto, and coupling the aligned substrates.

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