Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-06
2007-03-06
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S704000, C361S719000, C257S706000, C257S713000, C257S718000, C165S080500, C165S009100, C310S06800R, C310S06800R
Reexamination Certificate
active
10916896
ABSTRACT:
A power module that includes a lead frame having conductive pads molded in at the base thereof and a heatsink in thermal contact with the conductive pads through a thermally conductive adhesive.
REFERENCES:
patent: 5920119 (1999-07-01), Tamba et al.
patent: 6154369 (2000-11-01), Martinez et al.
patent: 6166464 (2000-12-01), Grant
patent: 6320747 (2001-11-01), Jahn et al.
patent: 6441520 (2002-08-01), Grant
patent: 411225459 (1999-08-01), None
Fissore Sergio
Grant William
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