Module for protecting and cooling computer chip die mounted on a

Details Module for protecting and cooling computer chip die mounted on a Module for protecting and cooling computer chip die mounted on a

1992-05-29

1993-12-28

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361707, 361694, H05K 720

Patent

active

052745309

ABSTRACT:
An electronic module and chassis for receiving a number of such modules wherein the modules are formed with bare die chips which are directly connected to substrate and metal cover plates which form opposite sidewalls of the modules. The chassis has cooling passages which are formed by metal sidewalls that form slots into which the modules are received so that coolant can provide conduction cooling.

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"Low-Profile Ceramic-Card Package", IBM Technical Disclosure Bulletin, vol. 28, No. 5, Oct. 1985, pp. 2114-2115.

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