Module for packaging and electrically interconnecting integrated

Details Module for packaging and electrically interconnecting integrated Module for packaging and electrically interconnecting integrated

1987-01-28

1988-01-26

Nimmo, Morris H.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29829, 29830, 174137A, 427289, 428161, H05K 100

Patent

active

047218312

ABSTRACT:
A module for packaging and electrically interconnecting integrated circuit chips comprises: a porous ceramic substrate which has a major surface that is pitted by a portion of the pores. Voltage planes and ground planes lie internal to the substrate, and metal filled via holes feed through the substrate. A second material fills the pores in the major surface to form a pit free surface. This second material is of a type which resists abrasion substantially less than the ceramic substrate. And metal lines are disposed over the pit free surface for interconnecting the metal filled via holes to the integrated circuits.

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