Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate
2002-09-17
2004-09-21
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Electromagnetic or particle radiation
C257S459000, C257S692000, C257S696000, C257S776000, C385S088000, C385S092000
Reexamination Certificate
active
06794724
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2001-287658, filed Sep. 20, 2001, the entire contents of which are incorporated herein by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a module for optical communications, for example, which coverts a light signal to signals of a differential form and outputs the signals, or which emits the light signal in response to the inputted differential signals.
2. Description of the Related Art
In recent years, due to the explosive growth of communication demands brought about by the Internet, there are now strong demands for an optical communications system. In an optical communications system, a module for an optical communications for use in a light transmitter/receiver has been required to be reduced in size and cost.
FIG. 10A
schematically shows a first example of a conventional module for the optical communications. As shown in
FIG. 10A
, a module for optical communications
101
includes a package
102
in which a light receiving element and wiring substrate described later are contained. In the package
102
, there are disposed: a light receiving element
104
which receives a light incident from an optical fiber
103
and photoelectrically converts the light; and a wiring substrate
105
. On the wiring substrate
105
, there are disposed: semiconductor devices (hereinafter referred to as IC) such as a preamplifier
106
which amplifies a signal from the light receiving element
104
; and wiring patterns
107
a,
107
b.
For an output of the preamplifier
106
, in recent years, a differential output form has frequently been used which has a reverse and non-reverse outputs in order to enhance an SN ratio with respect to an external noise. In this conventional example, for example, a connection pad
108
a
formed on an upper side outputs the non-reverse output, and a connection pad
108
b
on a lower side outputs the reverse output. The wiring patterns
107
a,
107
b
substantially have symmetric shapes in a perpendicular direction, and these wiring patterns
107
a,
107
b
are disposed opposite to each other. The connection pads
108
a,
108
b
and wiring patterns
107
a,
107
b
are connected to each other via bonding wires
109
. The wiring patterns
107
a,
107
b
are connected to lead pins
110
a,
110
b
in ends of the wiring substrate
105
.
The above-described module for optical communications
101
is disposed, for example, on a substrate, and the substrate is assembled in various apparatuses for use.
FIG. 11
shows a second conventional example of the module for optical communications. As shown in
FIG. 11
, a module for optical communications
121
includes the light receiving element
104
and wiring substrate
105
in the package
102
.
An IC
122
is disposed on the wiring substrate
105
. The IC
122
includes a connection pin
123
a
which outputs the reverse output and a connection pin
123
b
which outputs the non-reverse output. The connection pins
123
a,
123
b
are connected to wiring patterns
124
a,
124
b.
The wiring patterns
124
a,
124
b
are respectively connected to the lead pins
110
a,
110
b,
for example, via bonding wires.
Additionally, in the first conventional example, the lead pin
110
a
is connected to the connection pad
108
a
to output the non-reverse output, and the lead pin
10
b
is connected to the connection pad
108
b
to output the reverse output. However, in general, the arrangement of these lead pins is not optionally determined. In some apparatus (substrate) in which the module for optical communications
101
is assembled, a side on which the connection pads
108
a,
108
b
of the IC
106
are formed does not meet with a side on which the lead pins
110
a,
110
b
are formed. That is, the lead pin
110
a
forms the reverse output, and the lead pin
110
b
forms the non-reverse output. In this case, a separate IC needs to be prepared in which the upper connection pad
108
a
forms the reverse output, and the lower connection pad
108
b
forms the non-reverse output. This increases costs. Moreover, the IC with a connection pad arrangement that meets the demand of a user may not be manufactured.
Furthermore, conversely, depending on an IC maker, different from the aforementioned IC
106
, the positions of the reverse output and non-reverse output may be reversed. Therefore, similarly, connection relations between the connection pads
108
a,
108
b
and lead pins
110
a,
10
b
need to be reversed.
To switch the reverse and non-reverse outputs of the module for optical communications
101
without changing the arrangement of the wiring patterns
107
a,
107
b,
for example, as shown in
FIG. 10B
, a method is considered comprising: allowing the bonding wires
109
for connecting the connection pads
108
a,
108
b
to the wiring patterns
107
a,
107
b
to intersect with each other. That is, the connection pad
108
a
is connected to the wiring pattern
107
b,
and the connection pad
108
b
is connected to the wiring pattern
107
a.
In this method, however, since the bonding wires
109
intersect, there is a possibility of short-circuit. Moreover, since the bonding wires
109
are disposed in the vicinity of each other, a problem is deterioration of frequency properties by mutual inductance between the bonding wires
109
.
Moreover, in the second conventional example, for similar reasons, the connection pins
123
a,
123
b
of the IC
122
may not be on the same side as the lead pins
110
a,
110
b
in some cases. In this case, similarly as the first conventional art, it is necessary to prepare a separate IC that satisfies the condition, or a new wiring substrate
105
including the wiring pattern which satisfies the condition. This not only complicates a manufacturing process of the module for optical communications but also increases costs.
BRIEF SUMMARY OF THE INVENTION
According to a first aspect of the present invention, there is provided a module for optical communications comprising: a light receiving element receiving the light signal and converting the light signal to an electric signal; an insulating substrate including a first major surface and a second major surface opposite to the first major surface; an output section provided on the first major surface and extracting the electric signal as a reverse signal and non-reverse signal; first and second connection terminals connected to the output section, the reverse signal being outputted via the first connection terminal, the non-reverse signal being outputted via the second connection terminal; and first and second wiring patterns provided on the first major surface, one of the first and second wiring patterns being electrically connected to the first connection terminal, the other one of the first and second wiring patterns being electrically connected to the second connection terminal, the first wiring pattern including a first end, the second wiring pattern including a second end, and the first and second ends being provided in order in a direction intersecting with a line connecting the first and second connection terminals.
REFERENCES:
patent: 6285043 (2001-09-01), Yap
patent: 6603782 (2003-08-01), Nakanishi et al.
patent: 06-342858 (1994-12-01), None
Tanikoshi Sadao
Yoshida Masato
Hogan & Hatson LLP
Jackson Jerome
Kabushiki Kaisha Toshiba
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