Module for integrated circuits

Details Module for integrated circuits Module for integrated circuits

1979-03-21

1980-06-24

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 81, 174 16HS, H01L 2348, H01L 2944, H01L 2328

Patent

active

042097983

ABSTRACT:
A metal foil carrying a semiconductive chip, encased in a resinous body of generally rectangular outline, has a solid portion extending within the body from the region of the chip toward or beyond a major side of that body and terminates in a set of exposed, bent-over tongues symmetrically duplicating a set of conductor strips which are tied to respective chip terminals and pass outwardly along the opposite major side of the body. The solid foil portion and/or the tongues integral therewith are in contact with a heat-dissipating member disposed outside the resinous body.

REFERENCES:
patent: 3431092 (1969-03-01), Lehner
patent: 3611061 (1971-10-01), Segerson
patent: 3628483 (1971-12-01), Pauza
patent: 3651448 (1972-03-01), Pauza
patent: 3654695 (1972-04-01), Delgaudio et al.
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 3723833 (1973-03-01), Wheatley
patent: 3958075 (1976-05-01), Kaufman
patent: 4004195 (1977-01-01), Harayda et al.
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4093971 (1978-06-01), Chu et al.

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