Module for electronic package

Electricity: conductors and insulators – With fluids or vacuum – With cooling or fluid feeding – circulating or distributing

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Details

174 163, 174252, 361699, H05K 720

Patent

active

053068661

ABSTRACT:
A module containing an electronic package provides a housing for cooling and protecting the electronic package. A top metal shell and a bottom metal shell form a common cavity in which the package is embedded without touching the inner walls of the cavity. A flexible thermally conductive foil is fixed to each of the shells. The foil is adjustable to the surface of the package and is isolated from electrically conductive parts of the package. A cooling liquid fills the gaps between the metal shells and the foils. Flexible isolated circuit means connect the package to the outside of the housing, balancing means balance pressure and volume between the shells, and further means firmly hold together the housing.

REFERENCES:
patent: 4047198 (1977-09-01), Sekhon et al.
patent: 4381032 (1983-04-01), Cutchaw
patent: 4748495 (1988-05-01), Kucharek
patent: 4833567 (1989-05-01), Saaski et al.
patent: 4879629 (1989-11-01), Tustaniwakyj
patent: 4893590 (1990-01-01), Kashimura et al.
patent: 4933810 (1990-06-01), Cardashian et al.
patent: 5023695 (1991-06-01), Umezawa et al.
IBM Technical Disclosure Bulletin vol. 20, No. 2, Jul. 1977, "Liquid Cooled Module with Compliant Membrane" by E. G. Loeffel, S. W. Nutter and A. W. Rzant.
Patent Abstract of Japan, vol. 9, No. 328 (E-369) (2051) 24 Dec. 1985, and JP-A-60 160 145 (Mitsubishi Denki K.K.) Aug. 21, 1985.

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