Module for a data carrier with improved bump counterparts

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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C257S673000, C257S676000

Reexamination Certificate

active

07045711

ABSTRACT:
In a data carrier (1), or a module (3) for such a data carrier (1), the module (3) has an integrated component (4) with at least two projecting connection contacts (5, 6) and, for each connection contact (5, 6), a connecting part (7, 8) which is electrically conductively connected thereto, the connecting parts (7, 8) consisting of metal, being constructed so as to be plate-shaped, and including remnants (11) of raised portions which have been formed by mechanical deformation of the connecting parts (7, 8).

REFERENCES:
patent: 5326428 (1994-07-01), Farnworth et al.
patent: 5483741 (1996-01-01), Akram et al.
patent: 6281448 (2001-08-01), Tsukamoto
patent: 6297562 (2001-10-01), Tilly
patent: 6365967 (2002-04-01), Hembree et al.
patent: 6465879 (2002-10-01), Taguchi
patent: 6756661 (2004-06-01), Tsuneda et al.
patent: 6864423 (2005-03-01), Tan et al.
patent: 198 31 565 (1999-10-01), None

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